Overview

Drivers:

o Console o Clock o Ethernet - external lwIP fork repository

BSP variants:

TMS570LS3137:

tms570ls3137_hdk_intram - place code and data into internal SRAM tms570ls3137_hdk_sdram - place code and data into external SDRAM tms570ls3137_hdk - variant for stand-alone RTEMS application stored and running directly from flash..

TMS570LC4357:

tms570ls4357_hdk_sdram - place code and data into external SDRAM tms570lc4357_hdk - variant for stand-alone RTEMS application stored and running directly from flash.

Toolchain used for development

Example of RTEMS build configuration (config.ini) used for testing of self-contained applications running directly from flash:

[arm/tms570lc4357_hdk]

All patches required for Cortex-R and big-endian ARM support are already integrated into the GCC and RTEMS mainline.

MCU-specific flags used during compilation are located in externs/rtems/spec/build/bsps/arm/tms570/abi.yml

When linking an application to an RTEMs build, ensure the following flags are set (arm-rtems6-gcc/g++):

-mbe32
-qrtems
-T{RTEMS_BSP_VARIANT_LINKERSCRIPT}

RTEMS_BSP_VARIANT_LINKERSCRIPT can be found with the static libraries built for rtems. There is one for each BSP variant type. For example linkcmds.tms570lc4357_hdk

Execution

Application built by the above process can be directly programmed into Flash and run.

The following features are implemented in the _hdk BSP variants:

Initial CPU and peripheral initialization
Cores Self-test

For test and debug purposes, TI's HalCoGen generated application can be used to set up the board and then a RTEMS application can be loaded using OpenOCD to internal SRAM or external SDRAM. This prevents wear of Flash which has limited guaranteed erase cycles count.

Setup application code is available there: https://github.com/hornmich/tms570ls3137-hdk-sdram

A branch that enables loading to Flash via openocd on the TMS570LC4357 can be found here: https://github.com/len0rd/openocd

TMDS570LS31HDK setup to use SDRAM to load and debug RTEMS applications

o Program SDRAM_SCI_configuration-program or another boot loader (for example ETHERNET XCP is developed) o write BSP application either to sdram or intram and jump to RTEMS start code

ETHERNET

For ETHERNET, the lwIP port for TMS570LS3137 has been developed at Industrial Informatics Group of Czech Technical University in Prague and development versions are available on SourceForge.

RTEMS and TMS570 support is included in uLAN project lwIP repository

https://sourceforge.net/p/ulan/lwip-omk/

This port has been consolidated with other RTEMS-LWIP ports here:

https://gitlab.rtems.org/rtems/pkg/rtems-lwip/-/tree/main/rtemslwip/tms570

A port to the TMS570LC4357 based off this work is underway.

Adapt BSP for other TMS570 based hardware

Complete pin multiplexer initialization according to the list of individual pins functions is included. Pins function definition can be found and altered in a file

rtems/c/src/lib/libbsp/arm/tms570/hwinit/init_pinmux.c

Complete "database" of all possible pin functions for a chip is provided in a file

rtems/c/src/lib/libbsp/arm/tms570/include/tms570<MODEL>-pins.h

If another package or chip is considered then tools found in next repository can be used or extended to generate header files and pins "database"

https://github.com/AoLaD/rtems-tms570-utils

Links to additional information

Additional information about the CPU can be found at https://www.ti.com/product/tms570ls3137 https://www.ti.com/product/TMS570LC4357